Hydronaut thermal paste is designed for users with large cooling solutions, such as water cooling systems, who seek a high-quality product at an attractive price-performance ratio. It offers excellent thermal conductivity and can also be applied in overclocking scenarios. Technical details: Thermal resistance: 0.0076 K/W Electrical conductivity: 0 pS/m Viscosity: 140–190 Pas Density: 2.6g/cm3 Temperature range: -200 °C / +350°C Available sizes: 1g | 1.5ml/3.9g | 3ml/7.8g | 10ml/26g Hydronaut provides optimal heat transfer for large heat sources, commonly found in water cooling setups. Its silicone-free composition offers lightweight, flexible application. With its outstanding compatibility, Hydronaut can be used with most systems utilizing air or liquid nitrogen cooling (up to -200°C). It is a user-friendly thermal interface material for demanding users.
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